Nanogat van 0,14 nm bedreigt toekomst van 2D-chips

Researchers at TU Wien have identified a previously overlooked nanoscale gap of approximately 0.14 nanometers between 2D chip materials and their insulating oxide layers, which could undermine the miniaturization potential of next-generation semiconductors. Materials such as graphene and molybdenum disulfide have long been considered promising candidates for smaller, more efficient chips, but the study shows weak van der Waals bonding creates a separation that reduces gate control in transistors. The team suggests that so-called zipper materials with stronger interfacial bonding may offer a