3D-geprinte koperen koelplaten kunnen energieverbruik datacenters halveren

Researchers at the University of Illinois Urbana-Champaign have developed 3D-printed copper cold plates using topology optimization and electrochemical additive manufacturing to cool data center chips more efficiently. The new direct-to-chip liquid cooling technology could reduce data center cooling energy consumption from 30 percent to just 1.1 percent of total power usage. As artificial intelligence accelerates and data centers consume increasing amounts of energy, this innovation addresses a critical bottleneck in computer-chip design and offers a pathway toward more sustainable data